1. INTRODUCTION 1. INTRODUCTION 1.1 Purpose This manual provides the information necessary to repair, calibration, description and download the features of this model. 1.2 Regulatory Information A. Security Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges for your telecommunications services.
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1. INTRODUCTION E. Notice of Radiated Emissions This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user. F.
1. INTRODUCTION 1.3 Abbreviations For the purposes of this manual, following abbreviations apply: Automatic Power Control Baseband Bit Error Ratio CC-CV Constant Current - Constant Voltage Digital to Analog Converter Digital Communication System dB relative to 1 milli watt Digital Signal Processing EEPROM Electrical Erasable Programmable Read-Only Memory Electrostatic Discharge...
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1. INTRODUCTION Power Amplifier Module Printed Circuit Board Programmable Gain Amplifier Phase Locked Loop PSTN Public Switched Telephone Network Radio Frequency Receiving Loudness Rating Root Mean Square Real Time Clock Surface Acoustic Wave Subscriber Identity Module Sending Loudness Rating SRAM Static Random Access Memory PSRAM Pseudo SRAM...
2. PERFORMANCE 2. PERFORMANCE 2.1 H/W Features Item Feature Comment Li-Poly, 600mAh × 24(H) × 6.5(T) [mm] Standard Battery Battery Size : 36 (W) Battery Weight : TBD Under the minimum current consumption environment Stand by Current (such as paging period 9), the level of standby current is below 4mA.
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2. PERFORMANCE Item Description Specification DCS, PCS Offset from Carrier (kHz). Max. (dBm) Output RF Spectrum (due to switching transient) 1,200 1,800 Spurious Emissions Conduction, Emission Status GSM, EGSM BER (Class II) < 2.439% @-102 dBm Bit Error Ratio DCS, PCS BER (Class II) <...
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2. PERFORMANCE Item Description Specification STMR 13 5 dB Stability Margin > 6 dB dB to ARL (dB) Level Ratio (dB) 17.5 22.5 30.7 Distortion 33.3 33.7 31.7 25.5 Side Tone Distortion Three stage distortion < 10% System frequency 2.5ppm (13 MHz) tolerance 32.768KHz tolerance 30ppm...
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2. PERFORMANCE Item Description Specification Forced shut down Voltage 3.35 0.03 V 1 Li-Poly Battery Standard Voltage = 3.7 V Battery Type Battery full charge voltage = 4.2 V Capacity: 800mAh Switching-mode charger Travel Charger Input: 100 ~ 240 V, 50/60 Hz Output: 5.2 V, 800 mA - 14 -...
3. TECHNICAL BRIEF 3. TECHNICAL BRIEF 3.1 Transceiver (SI4210, U401) The RF parts consist of a transmitter part, a receiver part, a digitally-controlled crystal oscillator. The Aero® II transceiver is a complete RF front end for multi-band GSM and GPRS wireless communications.
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3. TECHNICAL BRIEF (1) Receiver Part The Aero II transceiver uses a digital low-IF receiver architecture that allows for the on-chip integration of the channel selection filters, eliminating the external RF image reject filters, and the IF SAW filter required in conventional superheterodyne architectures.
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3. TECHNICAL BRIEF The ADC output is downconverted to baseband with a digital quadrature local oscillator signal. Digital decimation and FIR filters perform digital filtering, and remove ADC quantization noise, blockers, and reference interferers. The response of the FIR filter is programmable to a flat pass band setting (FILTSEL = 0, Register 08h) and a linear phase setting (FILTSEL = 1, Register 08h).
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3. TECHNICAL BRIEF Figure. 3-3 SI4210 TRANSMITTER PART (3) Digitally-controlled crystal oscillator The Aero II transceiver integrates the DCXO circuitry required to generate a precise system reference clock using only an external crystal resonator. The DCXO replaces a discrete VC-TCXO module. The DCXO allows for the use of a standard 26 MHz crystal, which reduces both cost and area compared to using a VCTCXO module.
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3. TECHNICAL BRIEF The Aero II transceiver can be configured in DCXO mode or VC-TCXO mode by the XMODE pin. To use the transceiver in DCXO mode, the XMODE pin is tied high. The XTAL1 and XTAL2 pins are then connected directly to the 26 MHz crystal.
3. TECHNICAL BRIEF 3.2 Power Amplifier (SKY77328, U400) The RF parts consist of a transmitter part, a receiver part, a frequency synthesizer part, a voltage supply part, and a VCTCXO part. The SKY77328 Power Amplifier Module (PAM) is designed in a low profile (1.2 mm), compact form factor for quad-band cellular handsets comprising GSM850/900, DCS1800, and PCS1900 operation.
3. TECHNICAL BRIEF 3.3 26 MHz Clock (VCTCXO, X400) The 26 MHz clock(X501) consists of a TCXO(Temperature Compensated Crystal Oscillator) which oscillates at a frequency of 26 MHz. It is used within the SI4210, analog base band chipset (U101, AD6535ABCZ), digital base band chipset (U102, AD6527BABCZ). 2V75_VVCXO X400 R414...
3. TECHNICAL BRIEF 3.5 Digital Main Processor (AD6527B, U102) Figure 3-5. SYSTEM INTERCONECTION OF AD6527 EXTERNAL INTERFACE - 24 -...
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3. TECHNICAL BRIEF • AD6527 is an ADI designed processor. • AD6527 consists of 1. Control Processor Subsystem • 32-bit ARM7TDMI Control Processor • 58.5 MHz operation at 1.7V • On-board 16KB instruction/Data Cache • 1 Mbits of on-chip System SRAM 2.
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3. TECHNICAL BRIEF 3.4.1 Interconnection with external devices A. RTC block interface Countered by external X-TAL The X-TAL oscillates 32.768KHz B. RF interface The AD6527B control RF parts through PA_BAND, ANT_SW1, ANT_SW2, ANT_SW3 , CLKON , PA_EN, S_EN, S_DATA, S_CLK, RF_PWR_DWN. Signals Description PA_BAND (GPO 17)
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3. TECHNICAL BRIEF C. SIM interface The AD6527B provides SIM Interface Module. The AD6527B checks status periodically during established call mode whether SIM card is inserted or not, but it doesn't check during deep Sleep mode. In order to communicate with SIM card, 3 signals SIM_DATA, SIM_CLK, SIM_RST(GPIO_23) are required.
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3. TECHNICAL BRIEF 3.4.2 AD6527B Architecture Figure 3-7. AD6527B Architecture The internal architecture of AD6527B is shown above Figure 3-7. AD6527 regroups three main subsystems connected together through a dynamic and flexible communication bus network. It also includes onboard system RAM (SRAM) and interfaces with external Flash Memory, Baseband converter functions, and terminal functions like MMI, SIM and Universal System Connector (USC).
3. TECHNICAL BRIEF 3.5 Analog Main & Power Management Processor (AD6535, U101) Figure 3-8. AD6535 FUNCTIONAL BLOCK DIAGRAM - 29 -...
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3. TECHNICAL BRIEF • AD6535 is an ADI designed Analog Baseband processor. AD6535 covers the processing GMSK modulation interface, Aux ADC, Voice signal processing and Power Management. • AD6535 consists of 1. BB Transmit section • GMSK Modulation • I-channel & Q-channel Transmit DACs and Filters •...
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3. TECHNICAL BRIEF 3.5.1 Baseband Transmit Section 1. The AD6537B Baseband Transmit Section is designed to support GMSK for both single-slot and multi-slot application. 2. The AD6535 includes a digital GMSK modulator which is used for GSM application. The GMSK modulator uses a ROM lookup table to modulate the serial data stream ffrom the BSPORT.
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3. TECHNICAL BRIEF 3.5.3 Auxiliary Section 1. This section includes an Automatic Frequency Control(AFC) DAC, voltage reference buffers, an Auxiliary ADC, and light controllers. • AFC DAC: 13 bits 2. This section also contains AUX ADC and Voltage Reference • IDAC: 10 bits •...
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3. TECHNICAL BRIEF 3.5.4 Audio Section 1. The AD6535 Audio section supports communications and personal audio applications. 2. The Audio Section provides an audio codec with two digital-to-analog converter, a ring tone volume controller, a microphone interface, and analog input and output channels. Figure 3-12.
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3. TECHNICAL BRIEF 3.5.5 Power Management Figure 3-13. AD6535 POWER MANAGEMENT SECTION 1. Power up sequence logic 1. The AD6535 controls power on sequence 2. Power on sequence - If a battery is inserted, the battery powers the 8 LDOs. - Then if PWRONKEY is detected, the LDOs output turn on.
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3. TECHNICAL BRIEF Figure 3-14. AD6535 POWER MODE LOGIC 2. LDO Block 1. There are 8 LDOs in the AD6535. - VCORE : supplies Digital baseband Processor core and AD6535 digital core - VMEM : supplies external memory and the interface to the external memory on the digital baseband processor (1,8V or 2.8V, 150mA) - VEXT : supplies Radio digital interface and high voltage interface (2.8V, 170mA) - VSIM : supplies the SIM interface circuitry on the digital processor and SIM card (2.85V, 20mA)
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3. TECHNICAL BRIEF 3. Battery Charging Block 1. It can be used to charge Lithium Ion batteries. Charger initialization, trickle charging, and Li-Ion charging control are implemented in hardware. 2. Charging Process - Check charger is inserted or not - If AD6535 detects that Charger is inserted, the CC-CV charging starts. - Exception : When battery voltage is lower than 3.2V, the precharge(low current charge mode) starts firstly.
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3. TECHNICAL BRIEF Figure 3-17. BLOCKDIAGRAM Cradle Charge Current The cradle charge current is enabled by the EN pin only, the USBON pin has no control on the cradle charge current. The cradle charge current is programmed with the external resistor connected between the ICDL pin and the GND pin.
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3. TECHNICAL BRIEF Trickle Charge Current When the battery voltage is below the minimum battery voltage VMIN given in the electrical specification, the charger operates in a trickle/preconditioning mode, where the charge current is typically 14% of the programmed charge current for the cradle input. If power comes from the USB input, the trickle mode current is approximately 53mA.
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3. TECHNICAL BRIEF CONTROL REGISTER;ROM/SRAM The Control register and ROM/SRAM are accessed from”Instantaneous write register”,”Delayed write register”, and “Instantaneous read register”in the intermediate register. In the control register, there is a register to control the following synthesizer mainly. The voice parameter for FM(GM 128 voices+DRUM 40 voices)and wave data for WT are stored in ROM.
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3. TECHNICAL BRIEF LED,VIBRATOR CONTROL It is possible to synchronize an LED and vibrator with a play, and to control. Asynchronous control With a play is also supported. It supports 3 color LED control and it is possible to display 7 colors In maximum. CLOCK GENERATING BLOCK This device supports a clock input ranging from 1.5Mhz to 27Mhz.
3. TECHNICAL BRIEF 3.10 Microphone The microphone is placed to the front cover and contacted to main PCB. The audio signal is passed to AIN1P and AININ pins of AD6535. The voltage supply VMIC is output from AD6535, and is a biased voltage for the AIN1P.
4. TROUBLE SHOOTING 4. TROUBLE SHOOTING 4.1 RX Trouble TEST POINT 26Mhz OSCILLATOR SKY7477328 SI4210 Figure 4-1 - 54 -...
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4. TROUBLE SHOOTING Checking Flow START HP8960 : Test mode 62 CH, 7 level setting (TCH) 62CH, -60dBm setting (BCCH) Spectrum analyzer setting Oscilloscope setting Check VCTCXO Check FEM & Mobile SW Check RX IQ Redownload SW or Do calibration again - 55 -...
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4. TROUBLE SHOOTING (1) Checking VCTCXO Circuit TEST POINT Checking Flow VCTCXO Circuit is OK VCTCXO Circuit is OK Check Pin 3. 26 MHzO.K? See next Page to check See next Page to check Refer to Graph 4 -1(b) ANT SW & Mobile SW ANT SW &...
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4. TROUBLE SHOOTING (2) Checking FEM & Mobile SW Waveform TEST POINT VC_EGSM VC_DCSPCS FEM Control GSM & DCS & EGSM Graph 4-2(a) CIRCUIT GND13 PCS_RX2 GND12 PCS_RX1 GND11 DCS_RX2 GND10 DCS_RX1 GND9 EGSM_RX2 GND8 EGSM_RX1 FL400 GND7 GND6 HWXQ511 GND5 GND4 GND3...
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4. TROUBLE SHOOTING Checking Flow For these 2 test case, No Call connection is needed Check SW400 Pin ANT,RF Changing SW400 Open with RF Cable connected. Check SW400 Pin ANT,RF Short Changing SW400 with No RF Cable Connected Check C439,C440 VC_EGSM :Low Changing the Board.
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4. TROUBLE SHOOTING (4) Checking RX IQ TEST POINT CIRCUIT C423 C426 Waveform Graph 4-4 Checking Flow Check C423,C426. Check if there is any Replace U401 Similar? Major difference Refer to graph 4-4 Redownload software and calibration again - 59 -...
4. TROUBLE SHOOTING 4.2 TX Trouble TEST POINT 26Mhz OSCILLATOR SKY7477328 SI4210 Figure 4-2 - 60 -...
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4. TROUBLE SHOOTING Checking Flow START HP8960 : Test mode 62 CH, 7 level setting (TCH) 62CH, -60dBm setting (BCCH) Spectrum analyzer setting Oscilloscope setting Check VCTCXO Check FEM & Mobile SW Check SIGNAL Check TX IQ Redownload SW or Do calibration again - 61 -...
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4. TROUBLE SHOOTING (1) Checking VCTCXO Circuit TEST POINT Checking Flow VCTCXO Circuit is OK VCTCXO Circuit is OK Check Pin 3. 26 MHzO.K? See next Page to check See next Page to check Refer to Graph 4 -6(b) ANT SW & Mobile SW ANT SW &...
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4. TROUBLE SHOOTING (3) Checking Ant SW & Mobile SW TEST POINT CIRCUIT Waveform VC_DCSPCS VC_EGSM GND13 PCS_RX2 GND12 PCS_RX1 GND11 DCS_RX2 GND10 DCS_RX1 GND9 EGSM_RX2 GND8 EGSM_RX1 FL400 GND7 GND6 HWXQ511 GND5 FEM Control EGSM GND4 GND3 DCSPCS_TX Graph 4-7(a) GND2 EGSM_TX GND1...
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4. TROUBLE SHOOTING Checking Flow For the test, TX Stand alone Mode is needed. (PL=5 for GSM, PL=0 for DCS) Check C439,C440 Check whether FEM Check VC1, VC2, VC3 Changing board Set as TX mode Rrefer to Graph4-6(a), 4-6(b) Rrefer to Table 4-3 Check RF Level of Pin10 : ~32.5dBm Go to 4.3.5 Checking PAM...
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4. TROUBLE SHOOTING (4) Checking PAM Control Signal TEST POINT CIRCUIT (GPO_17) R400 PA_BAND R401 (GPO_16) PA_EN R402 TX_RAMP C407 C408 C406 Waveform Graph 4-8 Checking Flow Check TX_RAMP and PA_EN Check if there is Check if there is Similar? Similar? Similar? Download S/W...
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4. TROUBLE SHOOTING (5) Checking TX IQ TEST POINT Waveform Graph 4-9 CIRCUIT C423 XOUT C426 Checking Flow Check if there is Any Major Difference Similar? Replace U401 Refer to Graph 4-9 Redownload the Software And calibrate - 66 -...
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4. TROUBLE SHOOTING Checking Flow START Check Battery Voltage Charge or Change Battery > 3.35V ? Push power-on key Check the contact of power key And check the level change Or dome-switch of PWRKEY Check the voltage of Replace U101 The LDO outputs at U101 VCORE=1.8V VVCXO=2.75V...
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4. TROUBLE SHOOTING Checking Flow START Resolder the CN301 I/O Connector(CN301) Pin 12,13 : VCHARGE Is well-soldered ? Pin1,18,19,20,21,22 : GND Resolder the U205 are U205 well-soldered? Voltage across R209 is Replace theU205 about 1.2V? The battery may have Battery is charged? problems.
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4. TROUBLE SHOOTING Checking Flow SETTING : Enter the engineering mode, and set vibrator on at vibration of BB test menu START Check connection vibrator Connect vibrator Check the soldering Is the voltage at pin 6 of R202. Resolder R202. of Q201 near 0V? Replace Q201 Check soldering D201...
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4. TROUBLE SHOOTING Checking Flow START Refer to Power is supplied to Power On Trouble the board? Connection between Reconnect FPCB and boards is OK? FPCB CN102 Re-solder the CN102 is soldered well? Paths of LCD control Change the AIT811T signals are OK?(AIT811T) Paths of LCD control Re-solder the EMI FILTER...
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4. TROUBLE SHOOTING Checking Flow Is BT_RST signal shape similar Replace U102 to Fig.1 during Powering on Bluetooth Replace U201 2V8_VBT at C204=2.8V BT_EN is 2.8V Bluetooth Power off Replace U200 Is DEBUG_TX signal similar to Replace U201 Fig.2 during Powering on Bluetooth? Is DEBUG_RX signal similar to Replace U202...
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4. TROUBLE SHOOTING Checking Flow START Change the SIM Card. Our phone Does the SIM cards supports only 3V SIM card. supports 2.85V ? Voltage Voltage at pin1 of Replace J201 or at VSIM of U101 check soldering of components J201 is 2.85V? Is 2.85V? Change the SIM Card...
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4. TROUBLE SHOOTING Checking Flow START Resolder CN301 Does the audio Level at profile of the phone Replace CN301 JACK_DETECT signal change to the is low earphone mode? Set the audio part of the test equipment to Set the audio part of the test Change the earphone PRBS or continuous Equipment to echo mode...
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4. TROUBLE SHOOTING Checking Flow SETTING : After initialize Agilent 8960, Test EGSM, DCS, PCS mode Set the property of audio as PRBS or continuous wave. Set the receiving volume of mobile as Max. START Check the soldering Re-solder the receiver receiver Check the signal level of Check the soldering...
4. TROUBLE SHOOTING 4.12 Microphone Trouble TEST POINT C106 C118 R116 R105 R103,R104 Figure 4-14 CIRCUIT DIAGRAM R100 BACK_BATT C113 VCORE1 VCORE2 C114 VMEM1 VMEM2 CLOSE TO MIC C115 0.1u 2V5_VMIC VRTC C116 VSIM (1608) C117 2.2u VABB C118 VMIC R103 C119 VVCXO...
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4. TROUBLE SHOOTING Checking Flow SETTING : After initialize Agilent 8960, Test EGSM, DCS, PCS mode Set the property of audio as PRBS or continuous wave. Set the receiving volume of mobile as Max. START Check the soldering Re-solder the receiver receiver Check the signal level of Check the soldering...
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4. TROUBLE SHOOTING Checking Flow START Is the voltage level of BAT201 Charge or change BAT201. > 1.2V ? Check the voltage at Resolder R105 or 1,4 of X100 Replace X100 Change main board - 90 -...
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4. TROUBLE SHOOTING Checking Flow START Go to the LCD Trouble Does LCD work properly? Set the Camera button ON Check power U201 Check power 1.8V Change U201 1V8_CAM Check the 13MHz waveform? Change U103 Check U103 Check the C_PCLK Check the C_HS Check the C_VS Resolder CN202...
5. DOWNLOAD AND CALIBRATION 5. DOWNLOAD AND CALIBRATION 5.1 Download A. Download Setup Figure 5-1 describes Download setup Figure 5-1. Download Setup - 94 -...
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5. DOWNLOAD AND CALIBRATION B. Download Procedure 1. Run GSM Multi Download program and select Setting 2. Select Configuration from the menu and you may see this window. - 95 -...
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5. DOWNLOAD AND CALIBRATION 3. Press key to select DLL file and press Open KG320.dll 4. Press key to select the mot files 5. Select AlchemyData.mot and press open 6. Repeat step 4-5 to select CodeData.mot - 96 -...
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5. DOWNLOAD AND CALIBRATION 7. Check if the ADI option is set to Hermes 8. Press OK to end Configuration Select Rate - 97 -...
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5. DOWNLOAD AND CALIBRATION 9. Press START to execute download 10. Once downloading is started, press STOP button to keep from re-downloading after downloading is completed. - 98 -...
USB BOOT INT CLOCK KEY_COL2 KEYPADCOL2 USC4 USC4 Approved JEONG CHON BOK USB BOOT EXT CLOCK KEY_COL3 KEYPADCOL3 USC5 USC5 KEY_COL4 KEYPADCOL4 USC6 DRAWING Iss. Notice No. Date Name Ver 1.0 LG Electronics Inc. LGIC(42)-A-5505-10:01 LG Electronics Inc. - 101 -...
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01/13 Designer JEONG YI SEON 2 / 4 2006 Checked JEONG YI SEON DRAWING BLUE TOOTH/CHARGING IC//MEMORY NAME Approved JEONG CHON BOK DRAWING Iss. Notice No. Date Name Ver 1.0 LG Electronics Inc. LGIC(42)-A-5505-10:01 LG Electronics Inc. - 102 -...
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SIM_DATA JEONG YI SEON DRAWING KEY-FPCB CONN / SIDE KEY CONN NAME MM CONN / BtoB CONN JEONG CHON BOK C320 C319 DRAWING Iss. Notice No. Date Name Ver 1.0 LG Electronics Inc. LGIC(42)-A-5505-10:01 LG Electronics Inc. - 103 -...
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ANT_SW2 2006 0.01u 4.7u GSM_TX HIGH Checked LEE JIN DRAWING HIGH DCS/PCS_TX RF(AERO II) NAME GSM_RX Approved JEONG CHON BOK DCS_RX PCS_RX DRAWING Iss. Notice No. Date Name Ver 1.0 LG Electronics Inc. LGIC(42)-A-5505-10:01 LG Electronics Inc. - 104 -...
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01/13 Designer JEONG YI SEON 2006 Checked JEONG YI SEON 2006 KEY-FPCB DRAWING NAME KEY-FPCB(KEY, KEY-BACKLIGHT, MIC) Approved JEONG CHON BOK 2006 Ver 1.0 DRAWING Iss. Notice No. Date Name LG Electronics Inc. LG Electronics Inc. LGIC(42)-A-5505-10:01 - 105 -...
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JEONG YI SEON 2006 OUTPUT C130 C131 GND2 Checked PGND GND1 JEONG YI SEON DRAWING 0.01u UPPER-ADI U105 NAME A3212EEH-T Approved JEONG CHON BOK DRAWING Iss. Notice No. Date Name LG Electronics Inc. Ver 1.0 LG Electronics Inc. LGIC(42)-A-5505-10:01 - 106 -...
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JEONG YI SEON Close to AVDD 2 / 2 2006 DGND Checked JEONG YI SEON DRAWING UPPER-ADI NAME Approved JEONG CHON BOK DRAWING Iss. Notice No. Date Name Ver 1.0 LG Electronics Inc. LGIC(42)-A-5505-10:01 LG Electronics Inc. - 107 -...
9. ENGINEERING MODE 9. ENGINEERING MODE A. About Engineering Mode Engineering mode is designed to allow a service man/engineer to view and test the basic functions provided by a handset. B. Access Codes The key sequence for switching the engineering mode on is 2945#*#. Pressing END will switch back to non-engineering mode operation.
9. ENGINEERING MODE 9.1 BB Test [MENU 1] 9.1.1 LCD 1) COLOUR : WHITE, RED, GREEN, BLUE, BLACK 9.1.2 CAMERA This menu is to test the Camera. 1) Main LCD preview : It shows the picture on Main LCD. 2) Flash on : It turns on the Flash LED. 3) Flash off : It turns off the Flash LED.
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9. ENGINEERING MODE 9.1.6 ADC (Analog to Digital Converter) This displays the value of each ADC. 1) MVBAT ADC : Main Voltage Battery ADC 2) AUX ADC : Auxiliary ADC 3) TEMPER ADC : Temperature ADC 9.1.7 BATTERY 1) Bat Cal : This displays the value of Battery Calibration. The following menus are displayed in order : BAT_LEV_4V, BAT_LEV_3_LIMIT, BAT_LEV_2_LIMIT, BAT_LEV_1_LIMIT, BAT_IDLE_LI MIT, BAT_INCALL_LIMIT, SHUT_DOWN_VOLTAGE, BAT_RECHARGE_LMT...
9. ENGINEERING MODE 9.2 RF Test [MENU 2] 9.2.1 SAR test This menu is to test the Specific Absorption Rate. 1) SAR test on : Phone continuously process TX only. Call-setup equipment is not required. 2) SAR test off : TX process off 9.3 MF mode [MENU 3] This manufacturing mode is designed to do the baseband test automatically.
9. ENGINEERING MODE 9.3.7 MicSpk Test The sound from MIC is recorded for about 3 seconds, then it is replayed on the speaker automatically. 9.4 Trace option [MENU 4] This is NOT a necessary menu to be used by neither engineers nor users. 9.5 Call timer [MENU 5] This menu is to set the Digital Audio Interface Mode for Speech Transcoder and Acoustic testing.
10. STAND ALONE TEST 10. STAND ALONE TEST 10.1 Introduction This manual explains how to examine the status of RX and TX of the model. A. Tx Test TX test - this is to see if the transmitter of the phones is activating normally. B.
10. STAND ALONE TEST 10.3 Means of Test a. Select a COM port b. Set the values in Tx or Rx c. Select band and channel d. After setting them all above, press connect button. e. Press the start button Figure 10-1.
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10. STAND ALONE TEST Figure 10-2. HW test setting Figure 10-3. Ramping profile - 122 -...
11. AUTO CALIBRATION 11. AUTO CALIBRATION 11.1 Calibration A. Overview Auto-cal (Auto Calibration) is the PC side Calibration tool that perform Tx, Rx and Battery Calibration with Agilent 8960(GSM call setting instrument) and Tektronix PS2521G(Programmable Power supply). Auto-cal generates calibration data by communicating with phone and measuring equipment then write it into calibration data block of flash memory in GSM phone.
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11. AUTO CALIBRATION JTAG2 JTAG1 Status ADI-REMOTE TI-REMOTE POWER VBAT UART Status POWER Figure 11-3 The top view of Test JIG D. Test Jig Operation Power Source Description Power Supply Usually 4.0V Travel Adaptor Use TA, name is TA-20G(24pin) Table 11-2 Jig Power Switch Number Name Description...
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11. AUTO CALIBRATION LED Number Name Description LED 1 Power Power is provided for Test Jig LED 2 Indicate charging state of the phone battery LED 3 UART Indicate data transfer state through the UART port LED 4 Indicate data transfer state through the MON port Table 11-4 LED Description 1.
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11. AUTO CALIBRATION 4. Press Calibration START KG230 KG320 This model is KG320) Test band : GSM900/DCS 1800/PCS 1900 Max target : dfasdf 5. Select RF Cable Loss value from the Offset menu 6. Press START to execute calibration KG220 - 126 -...
11. AUTO CALIBRATION 11.2 AGC This procedure is for Rx calibration. In this procedure, We can get RSSI correction value. Set band EGSM and press Start button the result window will show correction values per every power level and gain code and the same measure is performed per every frequency.
12. EXPLODED VIEW & REPLACEMENT PART LIST 12.2 Replacement Parts Note: This Chapter is used for reference, Part order <Mechanic component> is ordered by SBOM standard on GCSC Location Level Description Part Number Specification Color Remark AAAY01 ADDITION AAAY0167901 Black ACGA00 COVER ASSY,BATTERY ACGA0016701...
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12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark MGAD01 GASKET,SHIELD FORM MGAD0116401 KG320 GASKET,SHIELD FORM(KEY) MGAD02 GASKET,SHIELD FORM MGAD0124201 GASKET,SHIELD FORM(INSERT) MLEY00 LOCKER MLEY0002201 Black MPBJ00 PAD,MOTOR MPBJ0030401 KG320 PAD,MOTOR MPBN00 PAD,SPEAKER MPBN0027801 KG320 FELT,SPEAKER MPBT00 PAD,CAMERA...
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12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark MIDZ00 INSULATOR MIDZ0094701 KG320 INSULATOR(SUB PCB) - 133 -...
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12. EXPLODED VIEW & REPLACEMENT PART LIST <Main component> Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC Location Level Description Part Number Specification Color Remark PCB ASSY,FLEXIBLE,SMT SACC00 SACC0021701 KG320 EUA_KEY PAD Black BOTTOM C101...
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12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R104 RES,CHIP ERHY0000247 2.2K ohm,1/16W,J,1005,R/TP R105 RES,CHIP ERHY0000220 100 ohm,1/16W,J,1005,R/TP R106 RES,CHIP ERHY0000222 120 ohm,1/16W,J,1005,R/TP R107 RES,CHIP ERHY0000222 120 ohm,1/16W,J,1005,R/TP R108 RES,CHIP ERHY0000222 120 ohm,1/16W,J,1005,R/TP R109 RES,CHIP ERHY0000222...
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12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark MLAC00 LABEL,BARCODE MLAC0003301 EZ LOOKS(use for PCB ASSY MAIN(hardware)) PCB ASSY,MAIN,SMT SAFC00 SAFC0069901 KG320 EUA_MAIN PCB Black BOTTOM ANT201 ANTENNA,GSM,FIXED SNGF0016701 3.0:1 ,0 dBd, ,8x2x1.2 B.T PIFA SMD Pb-Free C100 CAP,CERAMIC,CHIP ECCH0002002...
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12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C135 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP C136 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP C137 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP C138 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP C139 CAP,CERAMIC,CHIP ECCH0000122...
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12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C307 CAP,TANTAL,CHIP,MAKER ECTZ0004205 33 uF,6.3V ,M ,STD ,2012 ,R/TP C308 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP C309 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP C310 CAP,TANTAL,CHIP,MAKER ECTZ0004205...
Page 138
12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C422 CAP,CHIP,MAKER ECZH0000826 27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP C423 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP C424 CAP,CHIP,MAKER ECZH0000803 2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP C425 CAP,CERAMIC,CHIP ECCH0000178...
Page 139
12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark FL201 FILTER,CERAMIC SFCY0000901 2450 MHz,2.00*1.25*0.95 ,SMD ,Bluetooth Band Pass Filter FL301 FILTER,EMI/POWER SFEY0007401 SMD ,Coated type , CSP Package , 4-Channel ESD SMD ,SMD ,18 V,4ch. EMI_ESD Filter (100Ohm,15pF), Pb- FL303 FILTER,EMI/POWER SFEY0010501...
Page 140
12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R196 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R197 RES,CHIP ERHY0000261 10K ohm,1/16W,J,1005,R/TP R202 RES,CHIP ERHY0000254 4.7K ohm,1/16W,J,1005,R/TP R203 RES,CHIP ERHY0000273 47K ohm,1/16W,J,1005,R/TP R204 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP R207 RES,CHIP ERHY0000261...
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12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R410 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R412 RES,CHIP ERHY0000220 100 ohm,1/16W,J,1005,R/TP R413 RES,CHIP,MAKER ERHZ0000205 1 Mohm,1/16W ,F ,1005 ,R/TP R414 RES,CHIP ERHY0000220 100 ohm,1/16W,J,1005,R/TP R415 RES,CHIP ERHY0000263 15K ohm,1/16W,J,1005,R/TP R416...
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12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark Micro SMD, 5 Bump Package ,5 PIN,R/TP ,150mA-CMOS- U403 EUSY0133901 LDO,PBFREE VA100 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005 VA101 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005 VA201 VARISTOR SEVY0001001...
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12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C120 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP C121 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP C122 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C123 CAP,CERAMIC,CHIP ECCH0004904...
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12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C229 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C233 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP CONNECTOR, CN102 ENBY0025701 34 PIN,0.4 mm,ETC , ,H=1.5, Socket BOARD TO BOARD CN201 CONNECTOR,ETC ENZY0016601...
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12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R115 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R201 RES,CHIP ERHY0000265 20K ohm,1/16W,J,1005,R/TP R202 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R203 RES,CHIP ERHY0000273 47K ohm,1/16W,J,1005,R/TP R206 RES,CHIP ERHY0000220 100 ohm,1/16W,J,1005,R/TP R207 RES,CHIP ERHY0000244...