HP 10512 Disassembly Instructions Manual
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Also See for 10512:
- Specifications (42 pages) ,
- Datasheet (20 pages) ,
- Installation manual (121 pages)
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Product End-of-Life Disassembly Instructions
Product Category: Networking Equipment
Marketing Name / Model
[List multiple models if applicable.]
HP 10512 Switch Chassis (JC748A)
HP 10512 TAA Switch Chassis (JG823A)
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE)
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
Batteries
Mercury-containing components
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
External electrical cables and cords
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
EL-MF877-00
Template Revision B
Notes
With a surface greater than 10 sq cm
All types including standard alkaline and lithium coin
or button style batteries
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Includes background illuminated displays with gas
discharge lamps
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
Quantity
of items
included
in product
7
5
0
0
0
0
0
0
0
12
0
0
0
0
Page 1
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Summary of Contents for HP 10512
- Page 1 Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE) 1.0 Items Requiring Selective Treatment...
- Page 2 2.0 Tools Required List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed. Tool Description Tool Size (if applicable) Screw driver 3.0 Product Disassembly Process 3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment: 1.
- Page 3 47. Remove the film 12-2 from the part 12-1. 48. Unscrew the screws on pcb 10-2, and then remove pcb 10-2 from front panel 10-1. 49. Unscrew the screws on part 10-3, and then remove part 10-3 from front panel 10-2. 50.
- Page 4 Figure 3 Treatments to the product (rear view) Figure 4 Treatments to mounting angle 2 Figure 5 Treatments to front panel 3 Figure 6 Treatments to front blank panel 4 Figure 7 Treatments to front panel 5 Figure 8 Treatments to upper wire channel sets 6 EL-MF877-00 Page 4 Template Revision B...
- Page 5 Figure 9 Treatments to up fan frame 11 Figure 10 Treatments to down fan frame 12 Figure 11 Treatments to net board panel 10 Figure 12 Treatments to net blank panel Figure 13 Treatments to flue panel A 17 Figure 14 Treatments to flue panel B 18 Figure 15 Treatments to flue panel C 19 EL-MF877-00 Page 5...
- Page 6 3.3 Material of the facility built Facil Components Material Weight(g) Weight Selective treatment for Details percentage materials and components 45609 Fe recycling 47.96% 0.19% Fe recycling 30*24 Al recycling 1.63% 1520 Fe recycling 1.59% Complex 1300 The surface of PCB is greater 1.36% than 10 square centimeters;...
- Page 7 1520 Fe recycling 1.59% 25*2 Fe recycling 0.05% Complex 1900 The surface of PCB is greater 1.99% than 10 square centimeters; Be-Cu Cu recycling 0.00% Containing brominated flame 0.00% retardants 313.7 Fe recycling 0.32% 25.12* Al recycling 0.20% Fe recycling 0.13% 2500 2.62%...
- Page 8 10-3 Fe recycling 0.02% 10-4 Be-Cu Cu recycling 0.00% 10-5 Containing brominated flame 0.00% retardants 11-1 2370 Fe recycling 2.49% 11-2 Containing brominated flame 0.00% retardants 11-3 Al recycling 0.03% 11-4 Be-Cu Cu recycling 0.00% 11-5 Be-Cu Cu recycling 0.00% 11-6 Complex The surface of PCB is greater...
- Page 9 12-4 Be-Cu Cu recycling 0.00% 12-5 Be-Cu Cu recycling 0.00% 12-6 Complex The surface of PCB is greater 0.12% than 10 square centimeters; 12-7 350*4 1.40% Fe recycling 0.41% 1010 Fe recycling 1.06% 3470 Fe recycling 3.64% 16-1 2200 Fe recycling 2.32% 16-2 Pla recycling...
- Page 10 17-3 Be-Cu Cu recycling 0.00% 18-1 2610 Fe recycling 2.74% 18-2 Pla recycling 0.00% 18-3 Be-Cu Cu recycling 0.00% 19-1 2130 Fe recycling 2.24% 19-2 Pla recycling 0.00% 19-3 Be-Cu Cu recycling 0.00% Fe recycling 0.81% 0.65 Containing brominated flame 0.00% retardants 1970...
- Page 11 Complex The surface of PCB is greater 0.60% than 10 square centimeters; 4. Revised record Date Version Author Modify content 2012.04.20 Xiao Dujun Initial version 2013.10.14 Chen Longjun Add the module JG823A relation EL-MF877-00 Page 11 Template Revision B...