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Sony HCD-MX700Ni Service Manual

Sony HCD-MX700Ni Service Manual

Compact disc receiver
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HCD-MX700Ni/MX750Ni
SERVICE MANUAL
Ver. 1.0 2010.08
• HCD-MX700Ni is the amplifi er, wireless LAN, CD player, tuner, iPod/iPhone and USB section in CMT-MX700Ni.
• HCD-MX750Ni is the amplifi er, wireless LAN, CD player, DAB/DAB+ tuner, iPod/iPhone and USB section in CMT-MX750Ni.
Main unit
Tuner section
AUDIO POWER SPECIFICATIONS
FM tuner section:
POWER OUTPUT AND TOTAL HARMONIC
FM stereo, FM superheterodyne tuner
DISTORTION:
(The United States model only)
Tuning range:
With 6 ohm loads, both channels driven, from
North American model:
120 Hz – 10,000 Hz; rated 50 watts per channel
minimum RMS power, with no more than 10%
87.5 MHz – 108.0 MHz (100 kHz step)
total harmonic distortion from 250 milliwatts to
Other models:
rated output.
87.5 MHz – 108.0 MHz (50 kHz step)
Antenna:
Amplifier section
FM lead antenna
European model:
Intermediate frequency:
10.7 MHz
DIN power output (rated):
40 watts + 40 watts (6 ohms at 1 kHz, DIN)
DAB/DAB+ tuner section
Continuous RMS power output (reference):
(MX750Ni only):
50 watts + 50 watts (6 ohms at 1 kHz, 10% THD)
FM stereo, DAB/FM superheterodyne tuner
Music power output (reference):
50 watts + 50 watts (6 ohms at 1 kHz, 10% THD)
Frequency range
Band-III:
Other models:
174.928 (5A) MHz – 239.200 (13F) MHz
DIN power output (rated):
Antenna:
40 watts + 40 watts (6 ohms at 1 kHz, DIN)
DAB/FM lead antenna
Continuous RMS power output (reference):
DAB/DAB+ frequency table (Band-III)
50 watts + 50 watts (6 ohms at 1 kHz, 10% THD)
Frequency
Wireless LAN section
174.928 MHz
176.640 MHz
Compatible standards:
178.352 MHz
IEEE 802.11 b/g (WEP 64 bit, WEP 128 bit,
WPA/WPA2-PSK (AES), WPA/WPA2-PSK
180.064 MHz
(TKIP))
181.936 MHz
Radio frequency:
183.648 MHz
2.4 GHz
185.360 MHz
187.072 MHz
CD player section
188.928 MHz
System:
190.640 MHz
Compact disc and digital audio system
192.352 MHz
Laser Diode Properties
194.064 MHz
Emission Duration: Continuous
195.936 MHz
Laser Output*: Less than 44.6μW
197.648 MHz
* This output is the value measurement at a distance of
200mm from the objective lens surface on the Optical
199.360 MHz
Pick-up Block with 7mm aperture.
201.072 MHz
Frequency response:
202.928 MHz
20 Hz – 20 kHz
204.640 MHz
Signal-to-noise ratio:
206.352 MHz
More than 90 dB
208.064 MHz
Dynamic range:
More than 90 dB
9-889-945-01
Sony Corporation
2010H05-1
©
2010.08
Published by Sony Techno Create Corporation
Photo: HCD-MX750Ni
Model Name Using Similar Mechanism
CD Mechanism Type
Optical Pick-up Block Name
SPECIFICATIONS
Frequency
Label
209.936 MHz
10A
211.648 MHz
10B
213.360 MHz
10C
215.072 MHz
10D
216.928 MHz
11A
218.640 MHz
11B
220.352 MHz
11C
222.064 MHz
11D
223.936 MHz
12A
225.648 MHz
12B
227.360 MHz
12C
229.072 MHz
12D
230.784 MHz
13A
232.496 MHz
13B
234.208 MHz
13C
235.776 MHz
13D
237.488 MHz
13E
239.200 MHz
13F
iPod/iPhone section
Compatible iPod/iPhone models:
Label
5A
5B
5C
iPhone 3GS
iPhone 3G
iPhone
5D
6A
6B
6C
6D
7A
iPod classic
iPod nano
iPod classic
7B
120 GB 160 GB
4th generation
160 GB
(2009)
(video)
(2007)
7C
7D
8A
8B
8C
iPod classic
iPod nano
iPod
8D
80 GB
2nd generation
5th generation
(aluminum)
(video)
9A
9B
9C
9D
iPod
iPod mini
4th generation
Canadian Model
Australian Model
USB section
Supported bit rate:
MP3 (MPEG 1 Audio Layer-3): 32 kbps –
320 kbps, VBR
WMA: 48 kbps – 192 kbps, VBR
AAC: 48 kbps – 320 kbps
Sampling frequencies:
MP3 (MPEG 1 Audio Layer-3): 32/44.1/48 kHz
WMA: 44.1 kHz
AAC: 44.1 kHz
Inputs/Outputs
FM Antenna terminals:
75 ohms unbalanced
DAB/DAB+ Antenna terminal:
75 ohms, F female
AUDIO IN (stereo mini jack):
Sensitivity 700 mV, impedance 47 kilohms
iPod nano
iPod touch
5th generation
2nd generation
(video camera)
iPod touch
iPod nano
1st generation
3rd generation
(video)
iPod nano
iPod
1st generation
4th generation
(color display)
COMPACT DISC RECEIVER
US Model
E Model
HCD-MX700Ni
AEP Model
HCD-MX700Ni/MX750Ni
UK Model
HCD-MX750Ni
NEW
CDM85CD-DVBU102
KHM-313CAA
SPEAKERS:
Accepts impedance of 6 ohms
iPod/iPhone Dock:
Output voltage: DC 5.0 V
The maximum output current: 500 mA
(USB) port:
Type A, maximum current 500 mA
NETWORK
port:
10BASE-T/100BASE-TX
General
Power requirements:
North American model:
AC 120V, 60Hz
Latin American models (except for Brazilian
models):
AC 110 V – 120 V or 220 V – 240 V, 50/60 Hz,
adjustable with voltage selector
Brazilian model:
AC 127 V or 220 V, 60 Hz, adjustable with voltage
selector
Taiwan model:
AC 120 V, 50/60 Hz
Other models:
AC 220 V – 240 V, 50/60 Hz
Power consumption:
43 watts
Dimensions (W/H/D) (excl. speakers):
Approx. 309 mm × 122 mm × 247 mm
1
7
3
(approx. 12
/
inch × 4
/
inch × 9
/
inch)
4
8
4
Mass (excl. speakers):
Approx. 3.0 kg
(approx. 6 lb 10 oz)
Design and specifications are subject to change
without notice.
Standby power consumption: 0.5 W
Halogenated flame retardants are not used in the
certain printed wiring boards.

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Summary of Contents for Sony HCD-MX700Ni

  • Page 1 HCD-MX750Ni Photo: HCD-MX750Ni • HCD-MX700Ni is the amplifi er, wireless LAN, CD player, tuner, iPod/iPhone and USB section in CMT-MX700Ni. • HCD-MX750Ni is the amplifi er, wireless LAN, CD player, DAB/DAB+ tuner, iPod/iPhone and USB section in CMT-MX750Ni. Model Name Using Similar Mechanism...
  • Page 2 HCD-MX700Ni/MX750Ni • PARTY STREAMING and PARTY STREAMING logo are trademarks of Sony Corporation. SAFETY CHECK-OUT • VAIO and VAIO Media are registered trademarks of Sony Corporation. After correcting the original service problem, perform the follow- • MPEG Layer-3 audio coding technology and patents licensed from Fraunhofer IIS and Thom- son.
  • Page 3: Table Of Contents

    HCD-MX700Ni/MX750Ni TABLE OF CONTENTS SERVICING NOTES ..........DISASSEMBLY 2-1. Disassembly Flow ............2-2. Case ................. 2-3. NET Board Block ............10 2-4. Front Panel Block ............11 2-5. Knob (VOL) ..............12 2-6. SP Board ................. 12 2-7. MAIN Board ..............13 2-8.
  • Page 4: Servicing Notes

    HCD-MX700Ni/MX750Ni SECTION 1 SERVICING NOTES NOTE OF REPLACING THE WIRELESS LAN MODULE NOTES ON HANDLING THE OPTICAL PICK-UP (MOD1) BLOCK OR BASE UNIT When replacing the wireless LAN module (MOD1), MAC address is changed. Print the following explanation, cut it, and hand over it...
  • Page 5 Part No. HCD-MX700Ni: AEP model 4-189-496-0[] HCD-MX700Ni: US model 4-189-496-1[] HCD-MX700Ni: Canadian model 4-189-496-2[] HCD-MX700Ni: Taiwan model 4-189-496-4[] HCD-MX700Ni: Latin American model 4-189-496-5[] HCD-MX700Ni: Brazilian model 4-189-496-6[] HCD-MX750Ni: AEP, UK models 4-189-496-7[] HCD-MX750Ni: Australian model 4-189-496-8[] CAPACITOR ELECTRICAL DISCHARGE PROCESSING When checking the board, the electrical discharge is necessary for the electric shock prevention.
  • Page 6 HCD-MX700Ni/MX750Ni HOW TO OPEN THE TRAY WHEN POWER SWITCH TURN OFF bottom side 1 Insert the hard metal fittings of L character type in the hole of the chassis, and push the lever in the direction of the arrow. MAIN BOARD (COMPONENT SIDE), BD96U BOARD (COMPONENT SIDE) AND SP BOARD SERVICE POSITION...
  • Page 7 HCD-MX700Ni/MX750Ni NET BOARD SERVICE POSITION MAIN board NET board insulating sheet WIRELESS LAN MODULE (MOD1) LCD, KEY, JACK AND USB BOARDS SERVICE POSITION JACK board KEY board LCD board USB board JUNCTION board...
  • Page 8 HCD-MX700Ni/MX750Ni MAIN BOARD (CONDUCTOR SIDE) AND BD96U BOARD (CONDUCTOR SIDE) SERVICE POSITION MAIN board (conductor side) BD96U board (conductor side) POWER board DAB board (MX750Ni only) POWER BOARD SERVICE POSITION Note: Please disassemble each board from the chassis. POWER board...
  • Page 9: Disassembly

    HCD-MX700Ni/MX50Ni SECTION 2 DISASSEMBLY • This set can be disassembled in the order shown below. 2-1. DISASSEMBLY FLOW 2-2. CASE (Page 9) 2-4. FRONT PANEL BLOCK 2-3. NET BOARD BLOCK 2-6. SP BOARD (Page 11) (Page10) (Page 12) 2-7. MAIN BOARD (Page 13) 2-5.
  • Page 10: Net Board Block

    HCD-MX700Ni/MX750Ni 2-3. NET BOARD BLOCK 3 flexible flat cable (11 core) (CN1005) 7 NET board block 1 antenna cable Note: Please confirm the antenna cable is 2 Lift up the surely connected when you install coating clip. the NET board block.
  • Page 11: Front Panel Block

    HCD-MX700Ni/MX50Ni 2-4. FRONT PANEL BLOCK qd screw (BV3) qf lead wire (from HP board) 7 ferrite core 5 Lift up the coating clip. 9 connector (CN402) 8 flexible flat cable (15 core) (CN403) qs two screws (BV3) 6 flexible flat cable...
  • Page 12: Knob (Vol)

    HCD-MX700Ni/MX750Ni 2-5. KNOB (VOL) LCD board 2 knob (VOL) front panel block hole 1 Push the knob (VOL) by flat-head screwdriver. – Front panel block inside view – 2-6. SP BOARD 2 connector (CN703) 1 connector (CN702) 5 SP board...
  • Page 13: Main Board

    HCD-MX700Ni/MX50Ni 2-7. MAIN BOARD ql flexible flat cable (11 core) (CN411) qj heatsink (AMP) qd two screws (BV3) qf two coating clips qk radiation sheet qd three screws (BV3) w; cushion (ferrite) wa MAIN board 2 ferrite core 1 flexible flat cable...
  • Page 14: Cd Block

    HCD-MX700Ni/MX750Ni 2-9. CD BLOCK 2 four screws (BV3) Note 1: Do not remove this connector (CN201) at this point. It is necessary to process electrostatic measures of optical pick-up. 1 connector (CN301) bracket (front) 7 two claws 6 bracket (center)
  • Page 15: Bd96U Board

    HCD-MX700Ni/MX50Ni 2-10. BD96U BOARD Note 1: When disconnection the wire (fl at type) (24 core) of optical pick-up block, solder the short-land. 1 Solder the short-land. 2 flexible flat cable 24P (CN201) Note 2: When assembling the optical pick-up block, remove the solder of short-land after connecting the flexible flat cable 24P.
  • Page 16: Ffc Holder

    HCD-MX700Ni/MX750Ni 2-12. FFC HOLDER 3 FFC holder Note: Remove the FFC holder from the 2 two claws original set and install it again. 1 two claws 1 two claws – CD mechanism deck block bottom view – 2-13. OPTICAL PICK-UP BLOCK (KHM-313CAA)
  • Page 17: Test Mode

    HCD-MX700Ni/MX750Ni SECTION 3 TEST MODE COLD RESET 8. Press the [OPTIONS] button, the key test mode is activated and “K 0 V0” is displayed on the liquid crystal element. The cold reset clears all data including preset data stored in the 9.
  • Page 18 HCD-MX700Ni/MX750Ni CD SERVICE MODE Use this key to execute Command Out in the Command Out Mode. This mode can run the CD sled motor freely. Use this mode, for instance, when cleaning the optical pick-up. CD Servo Test Mode Tree:...
  • Page 19 HCD-MX700Ni/MX750Ni CD ERROR CODE 08: The disc chucking-release completion operation is in prog- ress. The past errors of the CD mechanism (CDM) are displayed as the CDM Errors, and those of the optical pick-up system (= optical 4 It indicates the operation during which the trouble has oc- unit + BD96U board) are displayed as the BD Errors as shown curred.
  • Page 20: Electrical Check

    HCD-MX700Ni/MX750Ni SECTION 4 ELECTRICAL CHECK FM TUNE LEVEL CHECK signal generator Procedure: 1. Turn on the set. 2. Input the following signal from signal generator to FM antenna input directly. Carrier frequency : A = 87.5 MHz, B = 98 MHz, C = 108 MHz...
  • Page 21: Diagrams

    HCD-MX700Ni/MX750Ni SECTION 5 DIAGRAMS 5-1. BLOCK DIAGRAM - CD, USB Section - (Page 22) 9 FOO HCD-MX700Ni/MX750Ni...
  • Page 22: Block Diagram - Tuner, Ipod/Iphone, Audio In Section

    HCD-MX700Ni/MX750Ni 5-2. BLOCK DIAGRAM - TUNER, iPod/iPhone, AUDIO IN Section - CD-L 1 IN-L2 ELECTRICAL VOLUME, (Page 21) INPUT SELECTOR IC502 SELECT SWITCH IC512 (MX750Ni) SP_L 7 IN-L5 SEL L 1-COM 13 VOL L OUT L (Page 23) SB L...
  • Page 23: Block Diagram - Network, Output, Panel Section

    HCD-MX700Ni/MX750Ni 5-3. BLOCK DIAGRAM - NETWORK, OUTPUT, PANEL Section - A/D CONVERTER STREAM PROCESSOR DIGITAL POWER AMP IC711 IC705 IC707 TB322 SP-L 2 AINL SDTO 9 31 DATA OUTL1 6 PWM_A OUT_A – (Page 22) OUTL2 PWM_B OUT_B R-CH 1 AINR...
  • Page 24: Block Diagram - Power Supply Section

    HCD-MX700Ni/MX750Ni 5-4. BLOCK DIAGRAM - POWER SUPPLY Section - VBUS +5V REGULATOR IC506 iPod +5V REGULATOR IC510 +3.3V A/D +3.3V REGULATOR IC702 +3.3V +3.3V D1002 CD A +3.3V REGULATOR IC505 +1.2V +3.3V +1.2V REGULATOR REGULATOR IC1003 IC1002 CD +5V REGULATOR...
  • Page 25 HCD-MX700Ni/MX750Ni THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS. • Circuit Boards Location. (In addition to this, the necessary note is printed in each block.) For Printed Wiring Boards. For Schematic Diagrams. SP board Note: Note: • X : Parts extracted from the component side.
  • Page 26: Printed Wiring Board - Bd96U Board (Side A)

    HCD-MX700Ni/MX750Ni 5-5. PRINTED WIRING BOARD - BD96U Board (Side A) - • See page 25 for Circuit Boards Location. • : Uses unleaded solder. (SPINDLE) (SLED) OPTICAL (LIMIT) PICK-UP BLOCK (Page 33) (KHM-313CAA) BD96U BOARD MAIN BOARD CN413 (SIDE A)
  • Page 27: Printed Wiring Board - Bd96U Board (Side B)

    HCD-MX700Ni/MX750Ni 5-6. PRINTED WIRING BOARD - BD96U Board (Side B) - • See page 25 for Circuit Boards Location. • : Uses unleaded solder. BD96U BOARD (SIDE B) R306 R316 X401 R221 R214 R229 R228 R224 R222 R213 R220 IC202...
  • Page 28: Schematic Diagram - Bd96U Board (1/2)

    HCD-MX700Ni/MX750Ni 5-7. SCHEMATIC DIAGRAM - BD96U Board (1/2) - • See page 30 for Waveforms. • See page 46 for IC Block Diagrams. • See page 51 for IC Pin Function Description. BD96U BOARD (1/2) BD96U C208 C160 1000p BOARD...
  • Page 29: Schematic Diagram - Bd96U Board (2/2)

    HCD-MX700Ni/MX750Ni 5-8. SCHEMATIC DIAGRAM - BD96U Board (2/2) - • See page 30 for Waveforms. • See page 46 for IC Block Diagrams. • See page 51 for IC Pin Function Description. BD96U BOARD (2/2) BD96U BOARD BUCK-B (1/2) (Page 28)
  • Page 30: Printed Wiring Board - Dab Board (Mx750Ni)

    HCD-MX700Ni/MX750Ni • Waveforms 5-9. PRINTED WIRING BOARD - DAB Board (MX750Ni) - • See page 25 for Circuit Boards Location. • : Uses unleaded solder. – BD96U Board – – MAIN Board – – NET Board – IC101 wf (XO)
  • Page 31: Schematic Diagram - Dab Board (Mx750Ni)

    HCD-MX700Ni/MX750Ni 5-10. SCHEMATIC DIAGRAM - DAB Board (MX750Ni) - • See page 46 for IC Block Diagrams. DAB BOARD ANTENNA DAB 75 CN01 DAB1 DAB TUNER MODULE CN672 AUDR AUDL CN671 A_GND AUD_SDOUTO C683 C684 C685 C686 JL671 AUD_SCLK AUD_SFR...
  • Page 32: Printed Wiring Board - Main Section (1/2)

    HCD-MX700Ni/MX750Ni 5-11. PRINTED WIRING BOARD - MAIN Section (1/2) - • See page 25 for Circuit Boards Location. • : Uses unleaded solder. MAIN BOARD (COMPONENT SIDE) (CHASSIS) (CHASSIS) IC515 IC512 C420 R597 C419 C421 IC709 C217 C117 C250 R594...
  • Page 33: Printed Wiring Boards - Main Section (2/2)

    HCD-MX700Ni/MX750Ni 5-12. PRINTED WIRING BOARDS - MAIN Section (2/2) - • See page 25 for Circuit Boards Location. • : Uses unleaded solder. (Page 38) NET BOARD MAIN BOARD (CONDUCTOR SIDE) CN1004 C221 C220 C121 C120 R595 C424 R598 R596...
  • Page 34: Schematic Diagram - Main Section (1/4)

    HCD-MX700Ni/MX750Ni 5-13. SCHEMATIC DIAGRAM - MAIN Section (1/4) - • See page 30 for Waveforms. • See page 46 for IC Block Diagrams. • See page 51 for IC Pin Function Description. (Page 36) MAIN BOARD (1/4) R565 Q512 4.7k (MX700Ni: US, CND, BR)
  • Page 35: Schematic Diagram - Main Section (2/4)

    HCD-MX700Ni/MX750Ni 5-14. SCHEMATIC DIAGRAM - MAIN Section (2/4) - • See page 46 for IC Block Diagrams. (AEP, UK) US, CND, E2, (MX750Ni) BR, TW, AUS ANTENNA ANTENNA FM 75 FM 75 COAXIAL COAXIAL (Page 31) (Page 41) SUPPLIED SUPPLIED...
  • Page 36: Schematic Diagram - Main Section (3/4)

    HCD-MX700Ni/MX750Ni 5-15. SCHEMATIC DIAGRAM - MAIN Section (3/4) - • See page 46 for IC Block Diagrams. MAIN BOARD (3/4) (Page 34) C124 Q507, 508 R163 MUTING CONTROL SWITCH R501 C174 C173 R600 MC[48] MAIN MC[47] BOARD R502 (1/4) C274...
  • Page 37: Schematic Diagram - Main Section (4/4)

    HCD-MX700Ni/MX750Ni 5-16. SCHEMATIC DIAGRAM - MAIN Section (4/4) - • See page 46 for IC Block Diagrams. MAIN BOARD (4/4) JL727 C722 FB701 2200p R765 A.GND /DCP C731 C723 L701 2200p CL710 10uH L712 /RST R711 10uH CN702 C701 C844...
  • Page 38: Printed Wiring Board - Net Board

    HCD-MX700Ni/MX750Ni 5-17. PRINTED WIRING BOARD - NET Board - • See page 25 for Circuit Boards Location. • : Uses unleaded solder. NET BOARD (CONDUCTOR SIDE) (CHASSIS) ET1001 ET1005 CN1006 C1037 R1064 R1065 NET BOARD (COMPONENT SIDE) CN1006 R1090 R1091...
  • Page 39: Schematic Diagram - Net Board

    HCD-MX700Ni/MX750Ni 5-18. SCHEMATIC DIAGRAM - NET Board - • See page 30 for Waveforms. • See page 46 for IC Block Diagrams. NET BOARD FB1003 D1002 DA2J10100L D1001 C1022 L1001 SJPJ-L3VL 10uH FB1002 FB1004 R1030 R1052 C1074 C1024 4.7k 2200p...
  • Page 40: Printed Wiring Boards - Ip/Jack/Sp/Usb Boards

    HCD-MX700Ni/MX750Ni 5-19. PRINTED WIRING BOARDS - IP/JACK/SP/USB Boards - • See page 25 for Circuit Boards Location. • : Uses unleaded solder. IP BOARD (COMPONENT SIDE) MAIN BOARD CN409 C343 (Page 33) IP BOARD (CONDUCTOR SIDE) CN331 R392 C332 R395...
  • Page 41: Schematic Diagram - Ip/Jack/Sp/Usb Boards

    HCD-MX700Ni/MX750Ni 5-20. SCHEMATIC DIAGRAM - IP/JACK/SP/USB Boards - IP BOARD JACK BOARD CN332 (iPod/iPhone Dock) R390 CN301 R260 J302 JL309 DGND (AIN-DET) C334 C333 C342 R336 R335 R333 R332 C332 C331 C256 C255 R303 JL308 AUDIO IN DGND 100k 100k...
  • Page 42: Printed Wiring Boards - Panel Section

    HCD-MX700Ni/MX750Ni 5-21. PRINTED WIRING BOARDS - PANEL Section - • See page 25 for Circuit Boards Location. • : Uses unleaded solder. KEY BOARD CN624 S631 S632 R651 R650 S621 S622 S623 S624 R643 R644 R645 S630 ENTER R642 R634...
  • Page 43: Schematic Diagram - Panel Section

    HCD-MX700Ni/MX750Ni 5-22. SCHEMATIC DIAGRAM - PANEL Section - • See page 46 for IC Block Diagrams. KEY BOARD R646 R645 R644 R643 R642 4.7k 2.2k 2.2k LCD BOARD S626 S625 S624 S623 S622 S621 D624 SML72423C-TP15 RV621 FUNCTION IC622 CN653...
  • Page 44: Printed Wiring Board - Power Board

    HCD-MX700Ni/MX750Ni 5-23. PRINTED WIRING BOARD - POWER Board - • See page 25 for Circuit Boards Location. • : Uses unleaded solder. PH11, 601, 602 (Page 33) MAIN BOARD POWER BOARD CN704 (EXCEPT AEP, UK) (CHASSIS) R608 C606 EP901 D905...
  • Page 45: Schematic Diagram - Power Board

    HCD-MX700Ni/MX750Ni 5-24. SCHEMATIC DIAGRAM - POWER Board - • See page 46 for IC Block Diagrams. • See page 51 for IC Pin Function Description. POWER BOARD CN902 Q901-903 POWER ON/OFF CONTROL T603 SUB POWER EVER 4V T5AH 250V TRANSFORMER...
  • Page 46 HCD-MX700Ni/MX750Ni • IC Block Diagrams – BD96U Board – – DAB Board – IC102 MM3404A15URE IC671 TK11133CSCL-G IC301 BA5826HFP-E2 IC672 SI-3010KM-TLS VO1(–) D.BUFF VO4(–) CE 1 BIAS VO1(+) D.BUFF D.BUFF LEVEL OVER HEAT & SHIFT VO4(+) VOLTAGE OVER CURRENT –...
  • Page 47 HCD-MX700Ni/MX750Ni IC507 BA6956AN IC512 SN74LV4052APWR 2-COM CONTROL LOGIC 1-COM IC702 MM3404A33URE IC712 MM3404A18URE IC703 MC74VHC74DTR2 13 12 11 CE 1 BIAS VOLTAGE – REFERENCE CURRENT LIMIT VOUT 1 2 3 4 5 6 GND 2 IC705 CXD9788AR CLOCK CLOCK GENERATOR...
  • Page 48 HCD-MX700Ni/MX750Ni IC707 CXD9965TN GVDD_B GVDD_A UNDER /OTW VOLTAGE 43 BST_A PROTECTION INTERNAL PULLUP 42 NC RESISTORS TO VREG POWER VREG PROTECTION PVDD_A RESET PVDD_A I/O LOGIC TEMP. OUT_A SENSE PWM_A BTL/P BTL-CONFIGURATION PULLDOWN RESISTORS OVERLOAD /RESET_AB ISENSE PROTECTION GND_A PWM_B...
  • Page 49 HCD-MX700Ni/MX750Ni – NET Board – IC1001 AK4388AET-E2 IC1003 SI-3010KM-TLS 16 DZF 15 DEM 14 VDD CLOCK DE-EMPHASIS MCLK DIVIDER CONTROL 13 VSS 12 VCOM BICK AOUTL INTERPOLATOR MODULATOR AUDIO SDTI DATA INTERFACE – LRCK 10 AOUTR INTERPOLATOR MODULATOR RSTN SMUTE...
  • Page 50 HCD-MX700Ni/MX750Ni – POWER Board – IC601 MIP2F20MS1SO 6.6V 8 SOURCE 7 SOURCE VDD CLAMP ILIMIT CIRCUIT CONSTANT CORRECTION CURRENT CIRCUIT SOURCE CLAMP CIRCUIT – (ILIMIT SETTING) DRAIN CURRENT DETECT FOR LIGHT LOAD DETECTION INTERMITTENT OSCILLATION CONTROL – AT TURNING ON VCL.OUT...
  • Page 51 HCD-MX700Ni/MX750Ni • IC Pin Function Description BD96U BOARD IC101 TC94A70FG-101 (CD-MP3 PROCESSOR) Pin No. Pin Name Description AVSS3 Ground terminal RFZI RF ripple zero crossing signal input terminal RFRP RF ripple signal output terminal SBAD Sub beam addition signal output terminal...
  • Page 52 HCD-MX700Ni/MX750Ni Pin No. Pin Name Description Micro controller interface mode selection signal input terminal Fixed at “H” in this set DOUT Digital audio data output terminal Not used AOUT1 Audio data output terminal Not used BCKO Bit clock signal output terminal...
  • Page 53 HCD-MX700Ni/MX750Ni BD96U BOARD IC401 92CD28AFG-7FU8 (M (USB CONTROLLER) Pin No. Pin Name Description USB-RST Reset signal input from the system controller “L”: reset I-USB-DI Ready to send signal input from the system controller 3, 4 INT1, INT2 Not used INT3 Function selection signal input terminal Fixed at “H”...
  • Page 54 HCD-MX700Ni/MX750Ni Pin No. Pin Name Description GATE Gate signal output to the CD-MP3 processor DVCC3A Power supply terminal (+3.3V) REQ-U Request signal input from the CD-MP3 processor ST-REQ Request signal input from the CD-MP3 processor 98, 99 PG1, PG0 Function selection signal input terminal Fixed at “H”...
  • Page 55 HCD-MX700Ni/MX750Ni MAIN BOARD IC401 R5F364AMDFA (SYSTEM CONTROLLER) Pin No. Pin Name Description FL/LCD DO Serial data output to the liquid crystal element FL/LCD SCL Serial data transfer clock signal output to the liquid crystal element FL/LCD CS Chip select signal output to the liquid crystal element...
  • Page 56 HCD-MX700Ni/MX750Ni Pin No. Pin Name Description CDM_OPEN_SW Switch detection signal input terminal for loading section CDM_CLOSE_SW Switch detection signal input terminal for loading section CDM_LOAD_IN Motor drive signal output terminal for the loading section CDM_LOAD_OUT Motor drive signal output terminal for the loading section...
  • Page 57 HCD-MX700Ni/MX750Ni POWER BOARD IC11 CXD9841P (POWER CONTROL) Pin No. Pin Name Description VSENSE AC line input voltage detection signal input terminal Feedback signal input terminal for frequency modulation of oscillator External capacitor connection terminal for oscillator External resistor connection terminal for oscillator...
  • Page 58: Exploded Views

    HCD-MX700Ni/MX750Ni SECTION 6 EXPLODED VIEWS Note: • -XX and -X mean standardized parts, so • Color Indication of Appearance Parts Ex- The components identifi ed by mark 0 they may have some difference from the ample: or dotted line with mark 0 are critical for original one.
  • Page 59: Front Panel Section

    HCD-MX700Ni/MX750Ni 6-2. FRONT PANEL SECTION iPod dock section not supplied not supplied (JUNCTION board) LCD601 not supplied (LCD board) not supplied not supplied (JACK board) (KEY board) not supplied not supplied (HOLDER board) not supplied (USB board) Ref. No. Part No.
  • Page 60: Ipod Dock Section

    HCD-MX700Ni/MX750Ni 6-3. iPod DOCK SECTION Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark X-2560-389-1 BASE (LOWER MX700) ASSY (MX700Ni) 1-838-389-21 CABLE, FLEXIBLE FLAT (13 CORE) X-2560-390-1 BASE (LOWER MX750) ASSY (MX750Ni) 4-175-952-01 SPRING (CLOSE), LEAF 4-175-945-01...
  • Page 61: Main Board Section

    HCD-MX700Ni/MX750Ni 6-4. MAIN BOARD SECTION not supplied MOD1 (SP board) CN1006 not supplied supplied not supplied not supplied not supplied not supplied not supplied (POWER board) ANT1 chassis section not supplied Note: When replacing the wireless LAN module (MOD1), refer to “NOTE OF REPLACING THE WIRE- LESS LAN MODULE (MOD1)”...
  • Page 62: Chassis Section

    HCD-MX700Ni/MX750Ni 6-5. CHASSIS SECTION CN01 DAB1 not supplied (DAB board) (MX750Ni) not supplied (MX750Ni) not supplied CD mechanism deck section not supplied (CDM85CD-DVBU102) not supplied supplied supplied (GUARD board) not supplied Ref. No. Part No. Description Remark Ref. No. Part No.
  • Page 63: Cd Mechanism Deck Section (Cdm85Cd-Dvbu102)

    HCD-MX700Ni/MX750Ni 6-6. CD MECHANISM DECK SECTION (CDM85CD-DVBU102) not supplied not supplied not supplied MS-203 board not supplied not supplied Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark A-1764-002-A CDM85 (CD) ASSY (Including MS-203 board) 0 255...
  • Page 64: Electrical Parts List

    HCD-MX700Ni/MX750Ni SECTION 7 BD96U ELECTRICAL PARTS LIST Note: • Due to standardization, replacements in • CAPACITORS When indicating parts by reference num- the parts list may be different from the uF: μF ber, please include the board name. parts specifi ed in the diagrams or the com- •...
  • Page 65 HCD-MX700Ni/MX750Ni BD96U Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark C502 1-128-995-21 ELECT CHIP 100uF R116 1-216-830-11 METAL CHIP 5.6K 1/10W C503 1-128-995-21 ELECT CHIP 100uF R120 1-216-864-11 SHORT CHIP C504 1-164-156-11 CERAMIC CHIP 0.1uF R121...
  • Page 66 HCD-MX700Ni/MX750Ni BD96U Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark R225 1-218-871-11 METAL CHIP 0.5% 1/10W R456 1-216-805-11 METAL CHIP 1/10W R226 1-218-871-11 METAL CHIP 0.5% 1/10W R457 1-216-809-11 METAL CHIP 1/10W R227 1-218-871-11 METAL CHIP 0.5%...
  • Page 67 HCD-MX700Ni/MX750Ni JACK JUNCTION Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark C690 1-162-915-11 CERAMIC CHIP 10PF 0.5PF R392 1-400-050-11 INDUCTOR, FERRITE BEAD C691 1-162-923-11 CERAMIC CHIP 47PF R393 1-216-864-11 SHORT CHIP R394 1-216-864-11 SHORT CHIP < CONNECTOR >...
  • Page 68 HCD-MX700Ni/MX750Ni Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark KEY BOARD S631 1-771-410-21 SWITCH, TACTILE ( V –) ********** (MX700Ni: E2, BR, TW/MX750Ni: AUS) S632 1-762-875-21 SWITCH, KEYBOARD (Z) < LED > (MX700Ni: US, CND, AEP/MX750Ni: AEP, UK)
  • Page 69 HCD-MX700Ni/MX750Ni MAIN Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark A-1760-912-A MAIN BOARD, COMPLETE (MX700Ni: AEP) C182 1-164-870-11 CERAMIC CHIP 68PF A-1760-927-A MAIN BOARD, COMPLETE (MX750Ni: AEP, UK) C183 1-164-854-11 CERAMIC CHIP 15PF A-1774-092-A MAIN BOARD, COMPLETE (MX700Ni: US, CND)
  • Page 70 HCD-MX700Ni/MX750Ni MAIN Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark C265 1-164-854-11 CERAMIC CHIP 15PF C482 1-164-870-11 CERAMIC CHIP 68PF C266 1-164-870-11 CERAMIC CHIP 68PF C267 1-164-854-11 CERAMIC CHIP 15PF C483 1-164-854-11 CERAMIC CHIP 15PF (MX750Ni)
  • Page 71 HCD-MX700Ni/MX750Ni MAIN Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark C564 1-165-908-11 CERAMIC CHIP 1uF C737 1-162-968-11 CERAMIC CHIP 0.0047uF C565 1-107-826-11 CERAMIC CHIP 0.1uF C738 1-124-779-00 ELECT CHIP 10uF C739 1-165-908-11 CERAMIC CHIP 1uF C566 1-107-826-11 CERAMIC CHIP 0.1uF...
  • Page 72 HCD-MX700Ni/MX750Ni MAIN Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark C822 1-162-966-11 CERAMIC CHIP 0.0022uF FB508 1-216-296-11 SHORT CHIP C823 1-162-966-11 CERAMIC CHIP 0.0022uF C824 1-162-966-11 CERAMIC CHIP 0.0022uF FB509 1-216-296-11 SHORT CHIP C825 1-162-966-11 CERAMIC CHIP 0.0022uF...
  • Page 73 HCD-MX700Ni/MX750Ni MAIN Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark IC712 6-714-743-01 IC MM3404A18URE R158 1-216-845-11 METAL CHIP 100K 1/10W R159 1-216-845-11 METAL CHIP 100K 1/10W < COIL > R163 1-216-813-11 METAL CHIP 1/10W L701 1-469-967-21...
  • Page 74 HCD-MX700Ni/MX750Ni MAIN Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark R365 1-216-864-11 SHORT CHIP R447 1-216-809-11 METAL CHIP 1/10W R366 1-216-864-11 SHORT CHIP R367 1-216-864-11 SHORT CHIP R448 1-216-809-11 METAL CHIP 1/10W R371 1-216-864-11 SHORT CHIP...
  • Page 75 HCD-MX700Ni/MX750Ni MAIN Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark R505 1-218-879-11 METAL CHIP 0.5% 1/10W R581 1-216-809-11 METAL CHIP 1/10W R582 1-216-809-11 METAL CHIP 1/10W R506 1-216-864-11 SHORT CHIP R583 1-216-833-11 METAL CHIP 1/10W R513...
  • Page 76 HCD-MX700Ni/MX750Ni MAIN MS-203 Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark R785 1-216-809-11 METAL CHIP 1/10W C1041 1-162-968-11 CERAMIC CHIP 0.0047uF R786 1-216-809-11 METAL CHIP 1/10W C1042 1-164-870-11 CERAMIC CHIP 68PF R787 1-216-809-11 METAL CHIP 1/10W...
  • Page 77 HCD-MX700Ni/MX750Ni POWER Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark FB1008 1-216-864-11 SHORT CHIP R1043 1-218-937-11 METAL CHIP 1/16W FB1009 1-216-864-11 SHORT CHIP R1044 1-218-937-11 METAL CHIP 1/16W FB1011 1-216-864-11 SHORT CHIP R1045 1-218-937-11 METAL CHIP...
  • Page 78 HCD-MX700Ni/MX750Ni POWER Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark 0 C11 0 D15 1-100-858-11 ELECT (BLOCK) 390uF 250V 6-501-178-01 DIODE UDZW-TE17-15B 0 D16 (EXCEPT AEP, UK) 6-501-178-01 DIODE UDZW-TE17-15B 0 C12 0 D17 1-100-858-11 ELECT (BLOCK) 390uF...
  • Page 79 HCD-MX700Ni/MX750Ni POWER Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark Q903 6-551-696-01 TRANSISTOR ISA1235AC1TP-1EF R933 1-216-833-11 METAL CHIP 1/10W Q904 8-729-620-07 TRANSISTOR 2SC3052EF-T1-LEF R934 1-216-821-11 METAL CHIP 1/10W R948 1-216-833-11 METAL CHIP 1/10W < RESISTOR >...
  • Page 80 HCD-MX700Ni/MX750Ni Ref. No. Part No. Description Remark USB BOARD ********** < CAPACITOR > C315 1-165-989-11 CERAMIC CHIP 10uF 6.3V C316 1-107-826-11 CERAMIC CHIP 0.1uF C317 1-107-826-11 CERAMIC CHIP 0.1uF < CONNECTOR > CN316 1-822-423-11 CONNECTOR, USB (A) ( ) *************************************************************...
  • Page 81 HCD-MX700Ni/MX750Ni MEMO...
  • Page 82 HCD-MX700Ni/MX750Ni REVISION HISTORY Checking the version allows you to jump to the revised page. Also, clicking the version at the top of the revised page allows you to jump to the next revised page. Ver. Date Description of Revision 2010.08...

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